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BS801C/02c/04c/06c/08c touch key selection table part. no. touch keys operating current at 3v key output type package serial interface auto calibration one-key state any-key state BS801C 1-key 3.0a level-hold or toggle sot23-6 bs802c 2-key 5.0a level-hold or toggle 8sop bs804c 4-key 3.0 a 8.0a 8sop level-hold or toggle 16nsop bs806c 6-key 3.0 a 14.0a level-hold 16nsop bs808c 8-key 3.0 a 18.0a 16nsop level-hold 20sop/ssop rev. 1.00 1 december 2, 2009 features operating voltage: 2.2v~5.5v ultra low current: 3.0 aat3v auto-calibration high reliability touch detections high psrr output type: level-hold or toggle one-key or any-key state key state mode set by pins or serial command open drain nmos output key status monitored using pins or serial bus general description the BS801C/02c/04c/06c/08c are a range of 1 to 8 key touch key devices which can detect human body contact using external touch pads. the high level of de - vice integration enable applications to be implemented with a minimum number of external components. the bs804c and bs808c are equipped with a one-line serial interface to allow easy communication with an exter - nal mcu for device setup and for touch pin monitoring pur - poses. special internal circuitry is also employed to ensure excellent power noise rejection to reduce the possibility of false detections, increasing the touch switch applica - tion reliability under adverse environmental conditions. with auto-calibration, low operating current and a low power one-key operating state, this range of touch key devices provides a simple and effective means of imple - menting touch switches in a wide variety of applications.
pin assignment pin description the pins in the following table are common to all devices. pin name i/o description key0~keyn input touch key n input. these pins are connected to the external touch key. kout0~koutn output touch key n output pin. cref input touch key reference capacitor input - value range of 0pf to 10pf - higher capacitance val- ues result in higher sensitivities. vss negative power supply, ground vdd positive power supply the following table shows device specific pins. pin name i/o device description okw input bs804c bs806c bs808c selects one-key state or any-key state. pin condition is read during power-up. the logic status of this pin must not be changed after power-on. after power-on this pin s function can be overridden by a serial command on relevant devices. pin connected to an internal pull-high resistor. internal circuitry ensures that this pull high resistor will not consume current even if the input is low. open: one-key state using key0 only low: any-key state scd input/ output bs804c bs808c serial bus pin used to communicate with an external mcu. the external mcu can read the bs804c or bs808c touch key status and also send commands to the device via this pin. lhf input BS801C bs802c bs804c selects key output type pin condition is read during power-up. the logic status of this pin must not be changed after power-on. after power-on this pin s function can be overridden by a serial command on relevant devices. pin connected to an internal pull-high resistor. internal circuitry ensures that this pull high resistor will not consume current even if the input is low. open: level-hold output low: toggle output note: it is important that the logic level of the okw and lhf pins do not change state after power-on. BS801C/02c/04c/06c/08c rev. 1.00 2 december 2, 2009

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absolute maximum ratings supply voltage ..........................v ss 0.3v to v ss +6.0v storage temperature ........................... 50 cto125 c input voltage .............................v ss 0 . 3v to v dd +0.3v operating temperature .......................... 40 cto85 c i ol total ................................................................80ma i oh total.............................................................. 80ma total power dissipation .....................................500mw note: these are stress ratings only. stresses exceeding the range specified under absolute maximum ratings may cause substantial damage to the device. functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. d.c. characteristics BS801C ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v dd operating voltage 2.2 5.5 v i dd operating current 3v no load 36 a v ih input high voltage 0.7v dd v dd v v il input low voltage 0 0.3v dd v i ol sink current 3v v ol =0.1v dd 48 ma r ph pull-high resistance 3v 20 60 100 k
bs802c ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v dd operating voltage 2.2 5.5 v i dd operating current 3v no load 510 a v ih input high voltage 0.7v dd v dd v v il input low voltage 0 0.3v dd v i ol sink current 3v v ol =0.1v dd 48 ma r ph pull-high resistance 3v 20 60 100 k
BS801C/02c/04c/06c/08c rev. 1.00 3 december 2, 2009
bs804c ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v dd operating voltage 2.2 5.5 v i dd1 operating current - one-key state 3v no load 3.0 6.0 a i dd2 operating current - any-key state 3v no load 8.0 16.0 a v ih input high voltage 0.7v dd v dd v v il input low voltage 0 0.3v dd v i ol sink current 3v v ol =0.1v dd 48 ma r ph pull-high resistance 3v 20 60 100 k
bs806c ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v dd operating voltage 2.2 5.5 v i dd1 operating current - one-key state 3v no load 3.0 6.0 a i dd2 operating current - any-key state 3v no load 14.0 28.0 a v ih input high voltage 0.7v dd v dd v v il input low voltage 0 0.3v dd v i ol sink current 3v v ol =0.1v dd 48 ma r ph pull-high resistance 3v 20 60 100 k
bs808c ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v dd operating voltage 2.2 5.5 v i dd1 operating current - one-key state 3v no load 3.0 6.0 a i dd2 operating current - any-key state 3v no load 18.0 36.0 a v ih input high voltage 0.7v dd v dd v v il input low voltage 0 0.3v dd v i ol sink current 3v v ol =0.1v dd 48 ma r ph pull-high resistance 3v 20 60 100 k
BS801C/02c/04c/06c/08c rev. 1.00 4 december 2, 2009
a.c. characteristics ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions f scd scd clock 3v 10.4 13.0 15.6 khz f krt key response time 3v 75 100 125 ms t kh maximum key hold time 3v 30 40 50 s t cal auto-calibration period 3v 1.8 2.5 3.2 s BS801C/02c/04c/06c/08c rev. 1.00 5 december 2, 2009 functional description introduction this range of bs80xc touch key devices offer an easy and reliable means of implementing touch switch func - tions in a range of applications. a single external capaci - tor is the only external component required for most applications while a single line serial bus offers conve - nient communication with an external mcu. device operation state there are two operating states known as the one-key state and the any-key state. devices with an okw pin, namely the bs804c, bs806c and bs808c, can oper- ate in either the one-key state or the any-key state. when these devices are powered up, the condition of the okw pin will be automatically read. if the okw pin is low then the device will enter the any-key state and if the pin is floating the device will enter the one-key state. as the BS801C and bs802c devices do not have an okw pin they will always operate in the any-key state. in the any-key state, as the name suggests all of the keyn touch inputs will be active, however in the one-key state only key0 will be active. after power up if the bs804c, bs806c and bs808c device enters the one-key state then touching any key other than key0 will have no effect. if a touch action is however detected on key0, then the device will enter the any-key state and operate normally with all keys active. however, within a timer period of around 20 seconds, if no touch actions are detected on any key input, then the device will revert to the one-key state. the advantage of choosing the one-key state over the any-key state is that it will result in lower power con - sumption as only one key remains active. the logic sta - tus of the okw pin is only read when the device powers up and will determine the operating state of the device after power-on. for the bs804c and bs808c devices, this power-on state can be overridden later by sending the appropriate command to the device on its scd pin. the logic level on the okw pin must not be changed af - ter power on. internal circuitry ensures that the internal pull-high resistor on the okw pin will not consume cur- rent after power-on. part no. okw open okw low bs804c bs806c bs808c one-key state any-key state the logic status of the okw pin is read when the device powers up. the logic level on this pin must not be changed after power on. internal circuitry ensures that the internal pull-high resistor on the okw pin will not consume current. part no. any-key on time in one-key state bs804c bs806c bs808c approx 20 secs
BS801C/02c/04c/06c/08c rev. 1.00 6 december 2, 2009 touch key outputs all kout pins have nmos structures to allow easy inter - facing to external devices with different operating volt - ages. the BS801C, bs802 and bs804c devices can have their outputs configured to operate with either level-hold or toggle type. the output type is deter - mined by the status of the lhf pin which is read during power-on. the logic level on this pin must not be changed after power on. internal circuitry ensures that the internal pull-high resistor on the lhf pin will not consume current. the bs806c and bs808c only have level-hold output types. part no. lhf kout type BS801C bs802c bs804c open level-hold low toggle bs806c bs808c level-hold serial interface scd both the bs804c and bs808c are equipped with a sin - gle line serial interface on the scd pin, allowing for easy interfacing to an external mcu. this single line interface allows communication in both directions between the touch key device and the external mcu. using this interface, the external mcu can serially read the status of the touch keys at any time. the serial interface also allows the external mcu to send com- mands to the touch key device. the serial interface al - lows three functions to be implemented, two are initiated by the external mcu and one by the bs80xc. scd command direction wake-up or interrupt mcu bs804c/bs808c mcu read touch key status step1: mcu send command mcu bs804c/bs808c step2: mcu read key status bs804c/bs808c mcu send command to bs804c/bs808c mcu bs804c/bs808c scd function summary bs804c/bs808c wakes-up or interrupts mcu when any of the touch keys change state, a pulse will be generated by the bs804c/bs808c device which can be used to wake up or to interrupt an external mcu. the mcu must ensure that its pin connected to the scd pin is setup as an input to receive this pulse. the pulse width generated by the device is equal to a t scd /2 period where t scd is about 76 s. # " $
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' bs804c, bs806c and bs808c operating flow 2 3 3 2 3 2 # 2 # wake-up/interrupt pulse to mcu
BS801C/02c/04c/06c/08c rev. 1.00 7 december 2, 2009 mcu reads the touch key status the mcu can send a command to the bs804c/ bs808c device to request the touch key status. the protocol for reading the touch key status is as follows: the external mcu takes control of the scd line and first sends three rising edge pulses or more to the bs804c/bs808c within a time of about 152 s. the mcu then changes its i/o pin to an input. the bs804c/bs808c device will then pull the scd line low, then high, the timings are given by syn - chronise period. this allows the mcu to synchro - nise itself for the data transfer. the bs804c/bs808c device will then transmit its key status, given by d0~dn for the bs804c, the data format is d0~d3. for the bs808c, the data format is d0~d7. the mcu can then read the key status taking care to read the data in the centre of the transmitted data pulse. after the last data bit is transferred the bs804c/ bs808c device will return its scd pin to an input state. the timings associated with the above protocol can be described in multiples of the scd clock periods. the scd clock period is about about 76 s. a certain time is required for the mcu to transmit three or more pulses to inform the device that it desires to read the key status. after this time has elapsed the de- vice will then transmit the data bits, d0~dn. device time bs804c 22 t scd bs808c 38 t scd key status read total time each bit of transmitted data corresponds directly to a touch input key. therefore the status of touch key key0 is represented by d0, key1 by d1 and so on. a low bit means that a touch has been detected, a high bit means no touch has been detected. pin data bit dn value key0 d0 1: key off 0: key on key1 d1 : : : : keyn dn mcu sends commands to bs804c/bs808c device the mcu can send commands along the scd line to setup the device in different operating state. to do this the externally connected mcu takes control of the scd line, first forcing it low and holding it low for a time of greater than 8 t scd cycles. this action will tem - porarily disable the device and enable it to receive the command from the mcu. any command sent to the device from the mcu will override the original power on configuration setup. the desired operating mode to be setup depends upon the number of pulses received by bs804c/ bs808c within a time period, 4 t scd , as shown in the table. after the programming clock cycles have been transmitted and the scd line returns high, the device will return to normal operation. clock pulses operating mode 0~2 set by external pin 3~6 for test purposes 7~10 one-key state 11~14 for test purposes >15 any-key state bs804c and bs808c scd commands note that the mcu must transmits these pulses within 4 t scd . maximum key on duration time to minimise the possibility of unintentional switch detec- tions, such as undesired objects covering the sense electrodes, the devices includes a maximum key-on duration time function. to implement this function the devices include an internal timer, which starts running after each switch detection. if the key on time of a touch key exceeds a value of about 40 seconds, then the de - vice will be reset to its power-on condition and initiate a new auto calibration. the output will then remain inac - tive until the next switch detection. auto-calibration function the devices include a full auto-calibration function which will be initiated after the device is powered-on. in addition to the power-on calibration, if no switch detec - tion has been made for more than about 2.5 seconds then a further calibration procedure will be carried out. the calibration is applied independently to each chan - nel on the devices. by implementing this feature, changes in the touch key environmental conditions are automatically catered for dynamically. ! $ 4 5 6 4 ( ) - - " ! , ! $ - - ' ! $ 7 4 8 $ * 9 * : # ! 8 - scd device setup
BS801C/02c/04c/06c/08c rev. 1.00 8 december 2, 2009 sensitivity adjustment the sensitivity of the switch is a very important consider - ation in most applications whose requirements will vary according to the user application. the user should therefore be aware of the factors which will affect the overall sensitivity of their touch key application. factors to take into consideration include the electrode size and the capacitance of the connection lines from the elec- trode to the bs80xc device. therefore the sensitivity will vary according to the actual pcb layout and design. an external capacitor, cs, connected to the cref pin, is used to set the overall sensitivity of all pins. some of the most important factors affecting sensitivity are the fol- lowing: cref capacitor value - cs the purpose of the cs capacitor is to allow for adjust - ment of touch key sensitivity and power noise rejec - tion. the optimal choice of sensitivity and power noise rejection will be obtained when the value of the cs ca - pacitor is equivalent to the touch pad capacitance, however the value can still be changed to obtain the required sensitivity value. higher cs values will result in higher levels of sensitivity. recommended values for cs are between 0pf and 10pf. touch key pad size larger touch key sizes will increase sensitivity and of course vice-versa, small electrode sizes will decrease sensitivity. touch key pad insulating panel thickness a thinner panel will result in higher sensitivity and of course thicker panels will result in a lower sensitivities. touch key pad insulating panel material the choice of the dielectric material for the panel will in- fluence the sensitivity. materials with higher dielectric constants will result in higher sensitivities and lower di- electric constants will result in lower sensitivities. ; ; ! " # ( ! - ( ! - < < $ % & ' 8 ) . = 5 6 ' - > 8 ? ! . ' - 3 $ 5 6 ' - 3 $ > 8 ? ! . ' - $ . # ! 8 $ . , $ ! -
' - 5 6 ' - 3 $ > 8 ? ! . ' - 3 $ $ scd pin touch key status request key cref touch key 0pf~ 10pf cs
application circuit note: if the output is connected to an mcu input with an internal pull high resistor then the pull high resistor on the ap - plication circuit is not required. BS801C/02c/04c/06c/08c rev. 1.00 9 december 2, 2009 key0 cref vss touch key0 0pf~ 10pf vdd lhf kout0 vdd 0.1uf r bs802c key1 touch key1 kout1 vdd vdd r cs key cref vss touch key 0pf~ 10pf vdd lhf kout vdd 0.1uf BS801C vdd r cs key0 cref vss touch key0 0pf~ 10pf vdd lhf kout0 vdd 0.1uf bs804c key3 touch key3 kout3 . . . . . . . . . scd intb or port mcu okw vdd vdd r r cs
note: if the output is connected to an mcu input with an internal pull high resistor then the pull high resistor on the ap - plication circuit is not required. BS801C/02c/04c/06c/08c rev. 1.00 10 december 2, 2009 key0 cref vss touch key0 0pf~ 10pf vdd kout0 vdd 0.1uf bs806c key5 touch key5 kout5 . . . . . . . . . vdd r vdd r okw cs key0 cref vss touch key0 0pf~ 10pf vdd okw kout0 vdd 0.1uf bs808c key7 touch key7 kout7 . . . . . . . . scd intb or port mcu vdd r vdd r cs
package information 8-pin sop (150mil) outline dimensions ms-012 symbol dimensions in mil min. nom. max. a 228 244 b 150 157 c12 20 c 188 197 d 69 e 50 f4 10 g16 50 h7 10 08 BS801C/02c/04c/06c/08c rev. 1.00 11 december 2, 2009 @ a & * ;
16-pin nsop (150mil) outline dimensions ms-012 symbol dimensions in mil min. nom. max. a 228 244 b 150 157 c12 20 c 386 394 d 69 e 50 f4 10 g16 50 h7 10 08 BS801C/02c/04c/06c/08c rev. 1.00 12 december 2, 2009 * ; & a @
20-pin sop (300mil) outline dimensions ms-013 symbol dimensions in mil min. nom. max. a 393 419 b 256 300 c12 20 c 496 512 d 104 e 50 f4 12 g16 50 h8 13 08 BS801C/02c/04c/06c/08c rev. 1.00 13 december 2, 2009 * ; & @ a
20-pin ssop (150mil) outline dimensions symbol dimensions in mil min. nom. max. a 228 244 b 150 158 c8 12 c 335 347 d49 65 e 25 f4 10 g15 50 h7 10 08 BS801C/02c/04c/06c/08c rev. 1.00 14 december 2, 2009 * ; & @ a
6-pin sot23-6 outline dimensions symbol dimensions in mm min. nom. max. a 1.0 1.3 a1 0.1 a2 0.7 0.9 b 0.35 0.50 c 0.1 0.25 d 2.7 3.1 e 1.4 1.8 e 1.9 h 2.6 3.0 l 0.37 19 BS801C/02c/04c/06c/08c rev. 1.00 15 december 2, 2009 & * ( * *
product tape and reel specifications reel dimensions sop 8n symbol description dimensions in mm a reel outer diameter 330.01.0 b reel inner diameter 100.01.5 c spindle hole diameter 13.0 +0.5/-0.2 d key slit width 2.00.5 t1 space between flange 12.8 +0.3/-0.2 t2 reel thickness 18.20.2 sop 16n (150mil) symbol description dimensions in mm a reel outer diameter 330.01.0 b reel inner diameter 100.01.5 c spindle hole diameter 13.0 +0.5/-0.2 d key slit width 2.00.5 t1 space between flange 16.8 +0.3/-0.2 t2 reel thickness 22.20.2 BS801C/02c/04c/06c/08c rev. 1.00 16 december 2, 2009 * ;
sop 20w symbol description dimensions in mm a reel outer diameter 330.01.0 b reel inner diameter 100.01.5 c spindle hole diameter 13.0 +0.5/-0.2 d key slit width 2.00.5 t1 space between flange 24.8 +0.3/-0.2 t2 reel thickness 30.20.2 ssop 20s (150mil) symbol description dimensions in mm a reel outer diameter 330.01.0 b reel inner diameter 100.01.5 c spindle hole diameter 13.0 +0.5/-0.2 d key slit width 2.00.5 t1 space between flange 16.8 +0.3/-0.2 t2 reel thickness 22.20.2 sot23-6 symbol description dimensions in mm a reel outer diameter 178.01.0 b reel inner diameter 62.01.0 c spindle hole diameter 13.00.2 d key slit width 2.500.25 t1 space between flange 8.4 +1.5/-0.0 t2 reel thickness 11.4 +1.5/-0.0 BS801C/02c/04c/06c/08c rev. 1.00 17 december 2, 2009
carrier tape dimensions sop 8n symbol description dimensions in mm w carrier tape width 12.0 +0.3/-0.1 p cavity pitch 8.00.1 e perforation position 1.750.1 f cavity to perforation (width direction) 5.50.1 d perforation diameter 1.550.1 d1 cavity hole diameter 1.50 +0.25/-0.00 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.00.1 a0 cavity length 6.40.1 b0 cavity width 5.20.1 k0 cavity depth 2.10.1 t carrier tape thickness 0.300.05 c cover tape width 9.30.1 sop 16n (150mil) symbol description dimensions in mm w carrier tape width 16.00.3 p cavity pitch 8.00.1 e perforation position 1.750.1 f cavity to perforation (width direction) 7.50.1 d perforation diameter 1.55 +0.10/-0.00 d1 cavity hole diameter 1.50 +0.25/-0.00 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.00.1 a0 cavity length 6.50.1 b0 cavity width 10.30.1 k0 cavity depth 2.10.1 t carrier tape thickness 0.300.05 c cover tape width 13.30.1 BS801C/02c/04c/06c/08c rev. 1.00 18 december 2, 2009 # # # &
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sop 20w symbol description dimensions in mm w carrier tape width 24.0 +0.3/-0.1 p cavity pitch 12.00.1 e perforation position 1.750.10 f cavity to perforation (width direction) 11.50.1 d perforation diameter 1.5 +0.1/-0.0 d1 cavity hole diameter 1.50 +0.25/-0.00 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.00.1 a0 cavity length 10.80.1 b0 cavity width 13.30.1 k0 cavity depth 3.20.1 t carrier tape thickness 0.300.05 c cover tape width 21.30.1 ssop 20s (150mil) symbol description dimensions in mm w carrier tape width 16.0 +0.3/-0.1 p cavity pitch 8.00.1 e perforation position 1.750.10 f cavity to perforation (width direction) 7.50.1 d perforation diameter 1.5 +0.1/-0.0 d1 cavity hole diameter 1.50 +0.25/-0.00 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.00.1 a0 cavity length 6.50.1 b0 cavity width 9.00.1 k0 cavity depth 2.30.1 t carrier tape thickness 0.300.05 c cover tape width 13.30.1 BS801C/02c/04c/06c/08c rev. 1.00 19 december 2, 2009
sot23-6 symbol description dimensions in mm w carrier tape width 8.00.3 p cavity pitch 4.00.1 e perforation position 1.750.10 f cavity to perforation (width direction) 3.500.05 d perforation diameter 1.5 +0.1/-0.0 d1 cavity hole diameter 1.5 +0.1/-0.0 p0 perforation pitch 4.00.1 p1 cavity to perforation (length direction) 2.000.05 a0 cavity length 3.150.10 b0 cavity width 3.20.1 k0 cavity depth 1.40.1 t carrier tape thickness 0.200.03 c cover tape width 5.30.1 BS801C/02c/04c/06c/08c rev. 1.00 20 december 2, 2009
BS801C/02c/04c/06c/08c rev. 1.00 21 december 2, 2009 copyright 2009 by holtek semiconductor inc. the information appearing in this data sheet is believed to be accurate at the time of publication. however, holtek as - sumes no responsibility arising from the use of the specifications described. the applications mentioned herein are used solely for the purpose of illustration and holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. holtek s products are not authorized for use as critical components in life support devices or systems. holtek reserves the right to alter its products without prior notification. for the most up-to-date information, please visit our web site at http://www.holtek.com.tw. holtek semiconductor inc. (headquarters) no.3, creation rd. ii, science park, hsinchu, taiwan tel: 886-3-563-1999 fax: 886-3-563-1189 http://www.holtek.com.tw holtek semiconductor inc. (taipei sales office) 4f-2, no. 3-2, yuanqu st., nankang software park, taipei 115, taiwan tel: 886-2-2655-7070 fax: 886-2-2655-7373 fax: 886-2-2655-7383 (international sales hotline) holtek semiconductor inc. (shenzhen sales office) 5f, unit a, productivity building, no.5 gaoxin m 2nd road, nanshan district, shenzhen, china 518057 tel: 86-755-8616-9908, 86-755-8616-9308 fax: 86-755-8616-9722 holtek semiconductor (usa), inc. (north america sales office) 46729 fremont blvd., fremont, ca 94538, usa tel: 1-510-252-9880 fax: 1-510-252-9885 http://www.holtek.com

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